DOI: 10.17586/2226-1494-2019-19-2-229-235


A. A. Kasyanov, G. N. Isachenko, K. L. Samusevich

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Kasianov A.A., Isachenko G.N., Samusevich K.L.Thermoelectric cooling module with damping conductor on cold spays. Scientific and Technical Journal of Information Technologies, Mechanics and Optics, 2019, vol. 19, no. 2,  pp. 229–235 (in Russian). doi: 10.17586/2226-1494-2019-19-2-229-235

Subject of Research.The paper presents results of study on a thermoelectric cooling module with damping heat and electrically conductive material for cold junctions. Telluride obtained by synthesis in a melting furnace is used as a thermoelectric element material. The size of a thermoelectric element is 2.0×2.0×1.5 mm. The modules were mounted on ceramic plates made of 96% Al2O3 with dimensions of 30×30×0.89 mm. Copper coated with a layer of nickel is used as the switching bus material. Modules were attached to the board by soldering. Tin and bismuth solder paste (melting point is equal to 139°С) was used as an assembly solder alloy. An electrically conductive EX-A302L silicone with specific resistance of 0.02 Ohm/cm, densityof 3.7 g/cm3 and thermal conductivity of 2.1 W/(m·K) was used for the damping compound. Methods. For efficiency increase of a thermal contact of a thermoelectric module, associated with large temperature gradient between hot and cold energy, especially for electrical n-elements, it is recommended to use an elastic electrically conductive adhesive. Elastic conductive adhesive based on silicone is proposed. Conductive silicone EX-A302L adhesive sealant consisted of single-component cold-vulcanized silicone with splashes of conductive microgranules. Working temperature from -50 to +120°C allows for the application of this adhesive both for conventional refrigeration modules, and for the cold junction of medium-temperature modules. A phased module assembly technology is developed. Main Results. Comparative tests are carried out for the experimental thermoelectric module and the standard industrial module of TB-31-2.0-1.5 thermoelectric module at measuring installations manufactured by Kryotherm company. The integrity of the modules was tested on Testo thermal imager. It is established that the difference between the working characteristics of experimental and industrial modules does not exceed 10% and lies within the permissible limits. It is found out that destruction dynamics of the modules after temperature cycling is virtually the same. Practical Relevance. The results obtained demonstrate the application possibility of electrically conductive adhesive as a contact layer for a thermoelement. The proposed technology will allow for replacing the materials of thermoelectric module branches with more efficient ones, but having different coefficients of temperature expansion, thereby increasing the efficiency of the thermoelectric device.

Keywords: thermoelectricity, thermoelectric module, silicides, electrically conductive silicone, thermal expansion coefficient

Acknowledgements. The experiment and measurements were carried out in Kryotherm Company.

  1. Amatya R., Ram R.J. Trend for thermoelectric materials and their Earth abundance. Journal of Electronic Materials, 2012, vol. 41, no. 6, pp. 1011–1019. doi: 10.1007/s11664-011-1839-y
  2. LeBlanc S., Yee S.K., Scullin M.L., Dames C., Goodson K.E. Material and manufacturing cost considerations for thermoelectric. Renewable and Sustainable Energy Reviews, 2014, vol. 32, pp. 313–327. doi: 10.1016/j.rser.2013.12.030
  3. Zheng X.F., Liu C.X., Yan Y.Y., Wang Q. A review of thermoelectrics research – Recent developments and potentials for sustainable and renewable energy applications. Renewable and Sustainable Energy Reviews, 2014, vol. 32, pp. 486–503. doi: 10.1016/j.rser.2013.12.053
  4. Zaitsev V.K., Fedorov M.I., Gurieva E.A., Eremin I.S., Konstantinov P.P., Samunin A.Y., Vedernikov M.V. Highly effective Mg2Si1-xSnx thermoelectric. Physical Review B, 2006, vol. 74, no. 4, art. 045207.
  5. Bashir M.B.A., Mohd Said S, Sabri M.F.M., Shnawah D.A, Elsheikh M.H. Recent advances on Mg2Si1−xSnx materials for thermoelectric generation. Renewable and Sustainable Energy Reviews, 2014, vol. 37, pp. 569–584. doi: 10.1016/j.rser.2014.05.060
  6. Gao P., Berkun I., Schmidt R., Luzenski M., Lu X., Bordon Sarac P., Case E., Hogan T.P. Transport and mechanical properties of high-ZT Mg2.08Si0.4-xSn0.6Sbx thermoelectric materials. Journal of Electronic Materials, 2014, vol. 43, no. 6, pp. 1790–1803. doi: 10.1007/s11664-013-2865-8
  7. Khan A.U., Vlachos N.V., Hatzikraniotis E., Polymeris G.S., Lioutas C.B., Stefanaki E.C., Paraskevopoulos K.M., Giapintzakis I., Kyratsi T.Thermoelectric properties of highly efficient Bi-doped Mg2Si1−x−ySnxGey materials. Acta Materialia, 2014, vol. 77, pp. 43–53. doi: 10.1016/j.actamat.2014.04.060
  8. Fedorov M.I. Thermoelectric silicides: past, present and future. Journal of Thermoelectricity, 2009, vol. 2, pp. 51–60.
  9. Engstrom I., Lonnberg B. Thermal expansion studies of the group IV‐VII transition‐metal disilicides. Journal of Applied Physics, 1988, vol. 63, no. 9, pp. 4476–4484. doi: 10.1063/1.340168
  10. Gelbstein Y., Tunbridge J., Dixon R., Reece M., Ning H., Gilchrist R., Summers R., Agote I., Lagos M.A., Simpson K., Rouaud C., Feulner P., Rivera S., Torrecillas R., Husband M., Crossley J., Robinson I. Physical, mechanical, and structural properties of highly efficient nanostructured n- and p-silicides for practical thermoelectric applications. Journal of Electronic Materials, 2014, vol. 43, no. 6, pp. 1703–1711. doi: 10.1007/s11664-013-2848-9
  11. Sondergaard M., Christensen M., Borup K.A., Yin H., Iversen B.B. Thermoelectric properties of the entire composition range in Mg2Si0.9925−xSnxSb0.0075. Journal of Electronic Materials, 2013, vol. 42, no. 7, pp. 1417–1421. doi: 10.1007/s11664-012-2282-4
  12. Bourgois J., Tobola J., Chaput L., Zwolenski P., Berthebaud D., Gascoin F., Recour Q., Scherrer H. Study of electron, phonon and crystal stability versus thermoelectric properties in Mg2X(X = Si, Sn) compounds and their alloys. Functional Materials Letters, 2013, vol. 6, no. 5, art. 1340005. doi: 10.1142/S1793604713400055
  13. Tani J., Takahashi M., Kido H. J. Fabrication of oxidation-resistant β-FeSi2 film on Mg2Si by RF magnetron-sputtering deposition. Journal of Alloys and Compounds, 2009, vol. 488, no. 1, pp. 346–349. doi: 10.1016/j.jallcom.2009.08.128
  14. Tani J., Takahashi M., Kido H. Thermoelectric properties and oxidation behaviour of Magnesium Silicide. IOP Conference Series: Materials Science and Engineering, 2011, vol. 18, art. 142013. doi: 10.1088/1757-899X/18/14/142013
  15. Nemoto T., Iida T., Sato J., Sakamoto T., Nakajima T., Takanashi Y. Power generation characteristics of Mg2Si uni-leg thermoelectric generator. Journal of Electronic Materials, 2012, vol. 41, no. 6, pp. 1312–1316. doi: 10.1007/s11664-012-1963-3
  16. Nemoto T., Iida T., Sato J., Sakamoto T., Hirayama N., Nakajima T., Nakajima T., Takanashi Y. Development of an Mg2Si unileg thermoelectric module using durable Sb-doped Mg2Si legs. Journal of Electronic Materials,2013, vol. 42, no. 7, pp. 2192–2197. doi: 10.1007/s11664-013-2569-0
  17. Nemoto T., Iida T., Sato J., Suda H., Takanashi Y. Improvement in the durability and heat conduction of uni-leg thermoelectric modules using n-type Mg2Si legs. Journal of Electronic Materials, 2014, vol. 43, no. 6, pp. 1890–1895. doi: 10.1007/s11664-013-2897-0
  18. Skomedal G., Holmgren L., Middleton H., Eremin I.S., Isachenko G.N., Jaegle M., Tarantik K., Vlachos N., Manoli M., Kyratsi T., Berthebaud D., Truong N.Y.D., Gascoin F. Design, assembly and characterization of silicide-based thermoelectric modules. Energy Conversion and Management, 2016, vol. 110, pp. 13–21. doi: 10.1016/j.enconman.2015.11.068

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