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Editor-in-Chief
Nikiforov
Vladimir O.
D.Sc., Prof.
Partners
THE INCREASING OF SOLDER JOINTS RELIABILITY UNDER THERMOMECHANICAL STRESS BY MEANS OF UNDERFILLING BALL GRID ARRAY OF BGA PACKAGES
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Abstract
The encapsulation process (underfilling) was examined, that traditionally has been used as a part of Flip Chip assembly process. It is proposed to use underfilling for long-term protection of BGA devices in harsh operating environments. Specific guidelines were defined to ensure stability and quality of the encapsu-lation of large BGAs. In addition, this paper includes experimental data on thermal cycling for protected and nonprotected BGA samples.
Keywords:
BGA΄s, reliability, underfill dispensing process, thermal cycle tests
