THE INCREASING OF SOLDER JOINTS RELIABILITY UNDER THERMOMECHANICAL STRESS BY MEANS OF UNDERFILLING BALL GRID ARRAY OF BGA PACKAGES

Гераничев Владимир Николаевич

2009 , VOLUME 09, NUMBER 1 ( JANUARY-FEBRUARY )

ISSN 2226-1494 (print), ISSN 2500-0373 (online)

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Nikiforov
Vladimir O.
D.Sc., Prof.

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THE INCREASING OF SOLDER JOINTS RELIABILITY UNDER THERMOMECHANICAL STRESS BY MEANS OF UNDERFILLING BALL GRID ARRAY OF BGA PACKAGES

Гераничев В.Н.

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Abstract

The encapsulation process (underfilling) was examined, that traditionally has been used as a part of Flip Chip assembly process. It is proposed to use underfilling for long-term protection of BGA devices in harsh operating environments. Specific guidelines were defined to ensure stability and quality of the encapsu-lation of large BGAs. In addition, this paper includes experimental data on thermal cycling for protected and nonprotected BGA samples.

Keywords: BGA΄s, reliability, underfill dispensing process, thermal cycle tests

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